新竹4/18-19 台日先進構裝RDL關鍵技術與市場動向
（一）高頻構裝材料產業發展趨勢
           2.  AiP與ABF相關材料應用與趨勢
           4. 圖案化介電與封裝材料之應用與趨勢

（二）先進封裝電鍍製程

（三）新穎感光性聚醯亞胺材料與先進封裝應用
          3. 微影製程與光阻劑
          4. 感光性高分子在先進封裝的應用

（四）RDL interconnect process for advanced semiconductor packaging
          1. Current move in leading edge semiconductor products
          2. New value creation with Mid-end process technologies
          3. Fundamentals of Cu RDL process for 3D device integration
          4. 3D Fan-Out Integration
               ● Low cost Cu Through Mold Interconnect process
               ● Panel Level Process(PLP)