Compound Semiconductor: Low Loss Encapsulant for High Frequency Module
■ Features
A new type of low-loss resin with low dielectric constant (Dk) and low dielectric dissipation factor (Df), and has the advantage of liquid molding material with high heat resistance.
▣ Low Loss Resin
▣ Properties of Low Loss Material
Dielectric properties of the low loss binder system
Dielectric properties of low loss encapsulant
■ Achievements
Low Temperature Degradable Epoxy Resin Material
■ Features
• Novel selective bond breaking resin
• Low temperature degradable
• Good fluidity
▣ Degradable Epoxy Resin
The new material can replace or partially replace of conventional resin materials. the application of materials could be bonded by pressure.
▣ Properties of Low Temperature Degradable Material
■ Achievement
TW Patent：110149642 (Under review)
US Patent：17/897,288 (Under review)
CN Patent：202210141269.6 (Under review)
Industrial Technology Research Institute (ITRI)
Material and Chemical Research Laboratories (MCL)
Dept. of Encapsulation Materials for Devices (V300)