Thermally Conductive Electrically Insulating Interface Materials
■ Features
• Coating on copper/PET
• High insulation, High peeling strength and thin thickness
• R2R process
■ Characteristics
※ thermal conductive according ASTM E1461
※ thermal impedance according ASTM D5470
■ Applications
Insulated Metal Substrate(IMS)
Single Phase Immersion Fluid
■ Two Phase vs. Single Phase
• Two phase：removing heat by phase transition of fluid
• Single phase：remove heat through heat exchanger and cooling fans
■ Features
• Fluoroalkyl-free，GWP=0
• Featured with high flash point 、good dielectric property and thermal stability
• Potential applications include: immersion cooling、 EV charging station ….etc.
■ Product and Services
• A new fluorine-free immersion fluid; patent pending (region ：Taiwan, USA, China)
• Measurement laboratory for immersion fluid：
(1) Thermal properties： conductivity, specific heat capacity, TGA
(2) Dielectric properties： volume resistivity, breakdown voltage
(3) Others：viscosity、flash point, acidity, surface tension,Dk, Df
(4) PCB component compatibility and accelerated aging
▣ Benchmark
Stretchable Conductive Material
■ Features
• Elongation, stretchable, twistable, bendable under 100% elongation
• Volume resuistance~1*10-4 Ωcm
• Screen printing
■ Core Technology
• Stretchable resin structure dispersion technology
• Conductive filler closest packing
SEM (Elongation 100%)
■ Applications
• Stretchable circuit
• Robot/smart clothes
• Medical/Health Management
▣ Benchmark
Die Attached Material
■ Features
• High electrical/thermal conductivity
• No pressure bonding process
• Excellent interface bonding strength with the coating
■ Core Technology
• Nano-metal powder surface modification
• Metal Coordination Resin Structure Design
■ Applications
• Power device
• 5G chip
• Smart phone
• Netcom equipment
▣ Benchmark
Atmospheric Sintering Copper Paste
■ Features
• Atmospheric sintering
• Good conductivity
• Good adhesion to substrate
• Good solvent resistance
• Low oxidation ratio
■ Core Technology
• Copper surface modification.
• Atmospheric sintering
The selected ligand material can coordinate with copper surface, undergo thermal decomposition and form a good conductive pathway through the reduced copper metal.
• Identification of surface modification
■ Applications
• Touch panel
• Flexible electronics
• PCB
▣ Benchmark
Industrial Technology Research Institute (ITRI)
Material and Chemical Research Laboratories (MCL)
Dept. of Flexible Substrate and Functional Materials (V200)