■ Technology Overview
We develop a series of excellently adhesive and UV-curable debonding comprising acrylic pressure sensitive adhesives with wide adhesion from 20 gf/in up to 2400 gf/in, which were successfully used for pattern wafer protection and temporary bonding of semiconductor backend process. The crucial bonding glue factors including adhesion, UV-curable and residue-free were systematically applicated in backside grinding and dicing via strong glue adhesion for fixation. The UV-curable adhesive glue widely used for wafer bonding/debonding on advance packaging and micro/mini-LED mass transfer on display applications.
■ Specifications
• Peeling strength with 100μm PET base film: 2400 gf/in before UV curing
• Peeling strength with 100μm PO base film: 1800 gf/in before UV curing
• Peeling strength: lower than 20 gf/in after UV curing
• Residue-free
■ Applications
• Mini LED/ Micro LED transfer
• 8” and 12” Temporary wafer bonding
• 8” and 12” Wafer back grinding
• LED/Wafer/MLCC dicing
Industrial Technology Research Institute (ITRI)
Material and Chemical Research Laboratories (MCL)
Dept. of Opto-Electronic Materials and Device Design (L100)