Composite Metal Foil & Primer for Low Temperature Lamination of LCP FCCL & Primer for Nodular Free Copper Foil & High Storage Modular PTFE Copper Clad Laminate

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Composite Metal Foil
■ Technology Overview
collectors play an important role in the charge/discharge process of batteries. For the basic mechanical properties of metal foil, electroplating a layer of lithiophilicity on the surface of copper foil reduces the nucleation over potential and inhibits the formation of lithium dendrites in lithium batteries. The composite metal current collector will change the deposition morphology, coulombic efficiency, cycle life, and safety of lithium metal.
 
Composite Metal Foil
 
■ Applications
• Lithium Metal Battery
• Anode-free Lithium Metal Battery
 
Primer for Low Temperature Lamination of LCP FCCL
 Technology Overview
Commercially LCP FCCL are produced by laminating copper foil and LCP film at about 380℃ by crawlertype lamination. In order to avoid copper foil oxidation, nitrogen gas must be passed during the lamination process, which increases the operating cost. The LCP film and the HVLP copper foil with primer can be laminated below 250℃ without nitrogen gas, and the peel strength is above 0.7 kg/cm.
 
■ Properties
Primer for Low Temperature Lamination of LCP FCCL
 
 Applications
• FCCL
 
Primer for Nodular Free Copper Foil
 Technology Overview
The high-frequency copper clad laminate is composed of ultra-low dielectric resin material and nodular free copper foil. Due to the poor adhesion between the resin and the copper foil, a primer is required to improve the peel strength between the resin and the copper foil without affecting the electrical properties of the substrate.
 
 Characteristic
• Cu foil Rz ≤ 1μm
• Nodular free
• Primer ≤ 4μm
• Excellent electrical
• Excellent peel strength
Primer for Nodular Free Copper Foil-Characteristic
 
 Properties
Primer for Nodular Free Copper Foil-Properties
 
High Storage Modular PTFE Copper Clad Laminate
 Technology Overview
The non-glass cloth type copper clad laminate has good Dk/Df uniformity and the best electrical properties above 77GHz. PTFE-silicon dioxide substrate material has excellent dielectric properties. The non-glass cloth type PTFE copper clad laminate has poor rigidity, and the introduction of small molecules with low polarity multifunctional groups can improve the rigidity of the substrate and reduce the difficulty of drilling.
 
 Characteristic
The small molecules with high temperature resistance and low polarity multifunctional groups are introduced into the PTFE-SiO2 substrate, and the modular of the substrate is improved through the crosslinking of small molecules.
High Storage Modular PTFE Copper Clad Laminate-Characteristic
 
 Properties
• D k ≤3.0,Df ≤0.001(@10GHz)
• Storage modulus ≅ 2240MPa (DMA @50℃ )
• Peel strength ≥ 7 lb/in (1/2 oz CF-V9S)
• CTE (Z axis)≤ 30ppm/℃
High Storage Modular PTFE Copper Clad Laminate-Properties
 

Industrial Technology Research Institute (ITRI)
 
Material and Chemical Research Laboratories (MCL)
Dept. of Applied Electrochemistry Research (K400)
 
相關文件:2023MCL-e-K400.pdf

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