■ Technology Overview
The technology uses an arc trigger to strike cathode target in order to initiate cathode spot and plasma flow through a new type of pulsed arc source power to excite atoms and ions which can be deposited on the surface of the substrate to form a thin film.
▣ Functional Coating (TiN, TiAlN, AlCrN, DLC, etc., 0.5-1.5 μm)
The advanced coating material laboratory integrates pulsed arc source, bend magnetic filter system and post-process polishing to establish a high level functional coating technology, which can be used in various applications for surface modification including hardness, wear-resistance, roughness, friction etc. The technology is applicable in precision machining, powder metallurgy mould and advanced semiconductor packaging and many other manufacturing fields.
▣ Electro Static Discharge (ESD, 4-6 μm)
The new generation of electro static discharge technology has overcome the problem of ESD damage in the traditional semiconductor packaging process, improves the process yield, and extend the service life of packaging and testing carrier board by at least 3 times longer by having multilayer films structure design and corrosion resistant protection. Also, replacing the previous hard anodising method that is not resistant to alkaline cleaning will help to break new ground in advance semiconductor packaging processes.
▣ Thick Coating (≥ 10 μm)
By calculating the internal stress and special multilayer film stack design, the film thickness of traditional functional coatings can be increased to ≥10 μm, which will increase the service life under strict conditions.
▣ Ultra Smooth Coating (Ra ≤ 0.005 μm)
The use of pulsed arc source with double-bend magnetic filter system can further filter out the particles from ion plating, and reduce the surface roughness below 0.005 μm. The technology is applicable in mirror finish mould, precision glass mould etc.
Industrial Technology Research Institute (ITRI)
Material and Chemical Research Laboratories (MCL)
Dept. of Advanced Coating Materials and Process System Integration Laboratory (J800)