Functional Precision Metal Coating
■ Technology Overview
An uniform and continuous metal/alloy film with high adhesion can be deposited on the metal or non-metal (glass, ceramics, plastics, fibers and graphite). For the different applications, the surface property can be adjusted, such as anti-abrasion or dimensional-stable. This technique is a wet process and has been applied to form fine metal line in Fan-Out and to fill the high AR TSV on glass and Si wafer. We also develop a method to fabricate thick Cu layer (300 μm) with high depositing rate (20 ASD) and a method to deposit a continuous nano-film with low resistance on plastic balls for ACF glue.
■ Specifications
Thickness: from tens of nm to hundreds of μm; current density: from 0.1 to 25 ASD
• The adhesion of 20 μm Cu film on glass is 5B (ASTM D3359)
• The adhesion of 3 μm Cu film on PI is 4B (ASTM D3359)
• Conductive plastic ball: form ≤ 100 nm metal film, contact resistance < 10 Ω
■ Applications
Fabricating fine metal line (L/S ≤ 2μm/ 2μm) in semiconductor package, thick Cu trace in high-power PCB, metal mesh in touch panel, and conductive plastic ball in ACF glue.
Fine Structure Forming and Functional Coating
■ Technology Overview
Functional coating with high heat dissipation, good dimensional stability, or anti-abrasion can be formed by electrochemical process accompanying with surface modification. Combining lithography, fine structure can be fabricated on the surface of device or mold. This technique is applied to the surface finish of vacuum equipment in optic-electrical process, micro-sensor, microfluidic precision mold, and anti-corrosion structure.
■ Features
• Accurate thickness control of anodic film (±1μm); applicable for ultra-vacuum environment needs and design of mass production line
• Periodic uniform AAO mold; min. hole size = 25 μm; max. are = A4
• Two-step precision etching and electroforming process; max. area = 500 x 500 mm2; min. feature = 10μm
• Metal composites micro-tube; I.D. = 70μm, O.D. = 90μm
• Design and fabrication of microfluidic in micro-reactor and ultra-thin heat pipe
■ Applications
Anodic film for tool parts in semiconductor equipment, metal mask in AMO LED, stencil in solar cell, microfluidic in heat pipe, precision sieve, microtubule probe, micro probe in semiconductor.
Industrial Technology Research Institute (ITRI)
Material and Chemical Research Laboratories (MCL)
Dept. of Precision Micro-Forming and Surface Materials Finishing (J400)