■ Technical services
The laboratory is oriented towards the development and application of heat dissipation materials. It integrates high thermal conductivity and heat dissipation inorganic materials, thermoelectric materials and thermal analysis simulation. In addition, it combines with material's thermal properties analysis and reliability verification platforms, to provide solutions for high-frequency, high-power components and modules to achieve rapid heat conduction and dissipation. Above all, it assists in the establishment and and operation of the Taiwan Thermal Management Association (TTMA).
We offer patents and research services in the field of high thermal conductive metal composites, high thermal conductive metal interface materials(TIM), ultra-thin vapor chambers(VC), ultra-thin copper alloy heat pipes(HP), and thermoelectric materials modules(TEM).
■ Ultra high thermal conductive Copper-diamond composite materials
▶ Core Value
With"extremely high thermal conductivity and precise thermal expansion matching" as
its core advantage, by incorporating highly conductive diamond into a copper matrix,
the overall thermal conductivity is significantly improved, effectively meeting the heat
dissipation demands in high heat flux environments. At the same time, diamond has
an extremely low coefficient of thermal expansion(CTE), which can adjust the overall
CTE of the material to be closer to semiconductors such as silicon and gallium nitride,
significantly reducing thermal stress and enhancing packaging reliability. This type of
material is particularly suitable for high-power-density chips and advanced packaging
technologies. The technological significance lies not only in the extreme improvement
of thermal conductivity but also in optimizing heat spreading and stress management
capabilities at the material level.
▶ Target Market
Primarily applied in high-end fields such as AI servers, high-performance computing(HPC),
advanced packaging, and high-end electronic cooling.
■ Cu-SiC composites
▶ Core Value
Centered on the key feature of 'controllable thermal expansion coefficient and balanced
performance and cost,' this material incorporates silicon carbide(SiC)particles into a
copper matrix. While maintaining excellent thermal conductivity, it can effectively adjust
the material's thermal expansion coefficient to more closely match the characteristics
of semiconductor components, thereby reducing thermal stress and improving overall
system reliability. In addition, this type of material has advantages in process maturity
and cost control, making it suitable for large-scale mass production. Its technical value
lies in balancing thermal management performance with industrial feasibility.
▶ Target Market
Widely applicable in markets such as 5G communication equipment, electric vehicle
power modules, general high-power electronic products, and thermal management solutions.
■ Thermoelectric Materials and Module Technology
▶ Application
Precision temperature control, heaters, coolers, waste heat recovery.
▶ Uniqueness
● Thermoelectric material formulation design and synthesis.
● Thermoelectric modules characteristic verification.
● Customized precision temperature control module application design.
● TEC Cooling module system design and assembly.
■ Full metallic TIM
▶ Core value
Liquid metal TIMs address the key limitations of conventional greases and phase change
materials in high-heat-flux AI cooling by combining high thermal transport potential, low
interfacial thermal resistance, and strong surface conformability. For high-power GPUs,
CPUs, AI accelerators, and advanced packages, they offer a pathway toward thinner
thermal interfaces, more efficient heat spreading, and improved compatibility with liquid
cooling and near-chip cooling architectures.
▶ Target markets
Primary application sectors include AI servers, high-performance computing,
semiconductor advanced packaging, liquidcooled thermal modules, power electronics,
and data center thermal management.
■ Heat dissipation simulation and mechanical optimization
▶ Application
To achieve optimal materials and mechanical design through simulating hot spot and
temperature distribution
▶ Uniqueness
◆ Module design and analysis(Gas、Liquid cooling)
● Heat dissipation simulation analysis of electronic components.
● Circuit board thermal simulation.
● Satellite orbital thermal control analysis.
■ Contact Us
Material and Chemical Research Laboratories
Dept. of Advance Thermal Management System Design & Application(J100)
Liu Yion-Ni
Tel:03-5913455
E-mail:itri960520@itri.org.tw