Electron Microscopy Development and Application

■ Technology Overview
Our analysis team have extensive experiences and diverse electron microscopy sample preparation techniques in various fields including metal materials, electronic and optoelectronic materials, biomedical materials, petrochemical materials, soft matter, composite functional devices, and many of the nanoproducts available in the market. We provide high-quality and efficient analysis results of electron  microscopes for businesses.
 
Electron Microscopy Development and Application
 
Electron Microscopy Development and Application
 
■ SEM inspection is highly used in IC, material, and optoelectronic industries
  ▶ High-quality large-surface sample preparation technique
     ● True observation surface area without stress failure. 
    ●  Cross-section of composite materials with large differences in hardness.
    ●  Large area(~cm)ion beam stress removal and micro etching technology.
  ▶ Nanoscale SDD EDS analysis
    ●  Structure and elemental composition analysis of multilayer membrane elements.
    ●  Element distribution analysis of trace doped element in the nanocomposite.
  ▶ EBSD analysis technique
    ●  Suitable for metallic and non-conductor materials.
    ●  Systematic analysis of EBSD diffraction patterns.
    ●  Analysis of crystalline orientation and preferential directions of polycrystalline.
    ●  Grain boundary property and grain size distribution analysis.
    ●  Micro-area multiphase structure identification.
    ●  KAM analysis: locally regional strain analysis of polycrystalline structures.
    ●  Large-area orientation and grain size analysis of giant grains(~mm scale)
    ●  Spatial resolution up to 30 nm.
  ▶ Low-damage and high-contrast SEM analysis
    ●  The performance and microstructure of high-value polymers are strongly correlated, but due to their
      composition of organic light elements, their ability to scatter electrons is weak, resulting in low electron
      density contrast in the electron microscopy. Therefore, the development of low-damage and high-contrast
      electron microscopy analysis techniques can provide an advanced material formulation development for the
      industry, academia, and research community.
  ▶ Cathodoluminescence(CL) analysis
    ●  Point spectrum measurement of luminescent devices.
    ●  Point bandgap analysis of semiconductor materials and devices.
    ●  CL analysis of laser-modified surfaces.
    ●  Microstructure and optical properties research of LED, OLED, QD, fluorescent and phosphorescent materials.
    ●  Widely used in the current optoelectronics industry.
  ▶ Liquid sample detection and analysis
    ●  Traditional drying methods often cause materials to shrink, resulting in deformation in the microstructure. In addition,
      organic/inorganic composite are often covered by organic substances on the surface, making it difficult to obtain
      the true morphology of the material. However, the true morphology of the material is often a key factor that affects
      its properties. Therefore, by using a liquid cell to create an atmospheric environment in the SEM vacuum environment,
      the original morphology of the sample can be preserved without distortion. This technique could give academia and
      industry opportunities to conduct advanced materials’research.
 
SEM inspection is highly used in IC, material, and optoelectronic industries
 
■ Staining and cryo-EM sample analysis
  ▶ Advanced low-temperature sample preparation and transfer technique
    ●  Suitable for vector’s analysis such as micelles, liposomes, proteins, etc.
    ●  Low temperature, low pressure, low radiation damage electron microscopy sample holder, very suitable for
       biological and polymer samples.
  ▶ Cryo-EM analysis of drug-loaded nanoparticles
    ●  By applying cryo-electron microscopy(cryo-EM) analysis and staining techniques, it is possible not
       only to obtain clear images of lipid nanoparticles (LNPs)but to determine the encapsulation state of
       mRNAs within.
 
Staining and cryo-EM sample analysis
 
  ▶ TAF certification for biomedical material services
    ● We established the first and only biotechnology TAF certification service in Taiwan.
      In addition to providing cryogenic electron microscopy(cryo-EM)testing and image
      analysis using liquid nitrogen cooling, it also offers structural information and
      dimensional certification services, including microstructural size identification,
      impurity composition analysis, and third-party accredited inspection reports.
  ▶ Biomolecular Electron Microscopy Imaging
    ● Suitable for biomedicine analysis, plant and animal cells, Bacteria Intelligent
      selection, and particle size measurement of biomolecular drugs.
  ▶ Intelligent Selection and Particle Size Measurement of Biomedical Materials
 
Staining and cryo-EM sample analysis
 
■ TEM inspection comprehensive services for electronics, optoelectronics, and petrochemical industries
  ▶ TEM Crystalline Structure Analysis
    ● TEM Crystalline Structure Analysis.
    ● Development of multi-angle crystal diffraction imaging techniques.
    ● Completed tilt angle range: ±30 degrees.
    ● Comprehensive applications of nano materials, polymer composite materials, electronic components, and energy
      industries for understanding crystallographic structures.
  ▶ Advanced semiconductor, automotive electronics,memory and other devices
   ● Research and development of advanced electronic materials and devices.
   ● Assist in optimizing process’s parameter and product failure analysis.
 
■ Precise electron-controlled aberration-corrected TEM(Cs-Corrected TEM)applied to twodimensional materials, advanced semiconductor devices (GAA), polymer  composites, and etched low-K materials
  ▶ Distortion-free atomic-level imaging capability.
  ▶ Distortion-free imaging system for light elements.
  ▶ Non-destructive Electron Energy Loss Spectroscopy(EELS)analysis. In addition to elemental information,
     it provides chemical bonding signals. Mapping results can be obtained within seconds to minutes, offering
     excellent resolution and clear differentiation for low atomic number elements.
  ▶ PED stress distribution analysis technique.
 
Precise electron-controlled aberration-corrected TEM(Cs-Corrected TEM)applied to twodimensional materials, advanced semiconductor devices (GAA), polymer  composites, and etched low-K materials
 
■ High-throughput and high-energy resolution X-ray fluorescence analysis
  ▶ High-throughput, rapid and accurate analysis of complex multicomponent compound
    ● Elemental analysis range: 4Be~92U.
    ● Applicable to various sample forms such as solids, liquids, powder, and thin film.
    ● Non-destructive testing.
    ● Qualitative/semi-quantitative/quantitative analysis.
    ● Confirmation of component and concentration of process trace impurities/contaminants.
    ● Analysis of hazardous substance composition and concentration(e.g. heavy metals)
  ▶ Measurement of thin film thickness and composition analysis on wafers
    ● Elemental analysis range: 4Be~92U.
    ● Film thickness range: 1 nm to 0.1 mm.
  ▶ Micro-area elemental mapping analysis
    ● Can generate elemental distribution maps and CCD sample observations.
    ● Spatial resolution <500μm.
 
High-throughput and high-energy resolution X-ray fluorescence analysis
 
■ Lithium battery testing services
  ▶ Environmentally protected low-temperature SEI layer imaging and phase analysis.
  ▶ Environmental protection low-temperature ion beam cross-section sample preparation.
  ▶ Lithium dendrite surface morphology and lithium dendrite cross-section structure.
  ▶ Distribution and composition of light elements(lithium)
  ▶ Half-cell, full-cell microstructure and failure analysis.
 
Lithium battery testing services
 
■ Contact Us
Material and Chemical Research Laboratories
Dept. of Electron Microscopy Development
and Application(M300)
 
Yen Yin-Cheng
Tel:03-5915469
E-mail:yyc@itri.org.tw