■ Technology
A series of excellently-adhesive and UV-curable debonding comprising acrylic pressure sensitive adhesives, and more importantly, with wide adhesion from 20 gf/in up to 2400 gf/in were successfully used for pattern wafer protection and temporary bonding of semiconductor backend process. The crucial bonding glue factors including adhesion, UV-curable and residue-free were systematically applicated in backside grinding and dicing via strong glue adhesion for fixation. The UV-curable adhesive glue widely used not only wafer bonding/debonding for advance packaging but panel level packaging application.
■ Specifications
▶ Peeling strength with 100μm PET base film: 2400 gf/in before UV curing.
▶ Peeling strength with 100μm PO base film: 1800 gf/in before UV curing.
▶ Peeling strength: lower than 20 gf/in after UV curing.
▶ Residue-free.
■ Applications
▶ Die to Wafer & Wafer to Wafer bonding.
▶ 8”and 12”Wafer temporary bonding.
▶ 8”and 12”Wafer back grinding & Dicing.
▶ Panel and Wafer level packaging.
■ Contact Us
Material and Chemical Research Laboratories
Dept. of Organic Opto-electronic Materials
and Applications(L100)
Kuan-Wei Chen
Tel:03-5917007
E-mail:Kuanweichen@itri.org.tw