High-Purity Metal Refining & Precision Plating Technology
■ Technology Overview
This technology platform is built upon electrochemical reaction engineering combined with interfacial chemistry and materials science. Via wet processes, it synthesizes various metallic materials. It enables purification and preparation of multiple high-purity metals(e.g., rare-earth metals, cobalt, aluminum)and deposition of uniform, dense, continuous metal layers(e.g., Cu, Ni, Au, Ag)on both conductive and non-conductive substrates.
■ Technology Features
▶ Substrate versatility: deposition of diverse metals/alloys from tens of nanometers up to
hundreds of micrometers on non-conductive or special substrates(glass, wafers, polymers,
ceramics, fibers, steel, aluminum, magnesium alloys, graphite)
▶ High-rate deposition: at 20 ASD current density, rapidly plate copper layers ≥ 300 μm.
▶ Strong adhesion: directly deposit 20 mm copper on glass or Si wafers, passing ASTM 5B
cross-cut adhesion tests.
▶ High material purity: small-batch validation of noble metals with purity >99%.
■ Key Features
▶ Fabrication of fine RDL for semiconductor packaging(L/S<2 mm/2 mm)and copper filling in
TSV/TGV processes.
▶ Thick-copper traces for high-power PCBs and metallic interconnects for touch panels.
▶ Production of high-purity precious metals(nation's first molten-salt electrolysis pilot line)
■ Applications
By integrating precision etching and electroforming with surface chemical modification and photolithography, high-performance structures—insulating, thermally conductive, low-deformation, high-strength,and corrosion-resistant—can be realized on molds and component surfaces.Applicable to surface treatments of vacuum equipment for semiconductor/optoelectronic processes, and to fabrication of microchannels and microstructures for microsensors/precision molds.
Precision Structures & Microforming
■ Technology Overview
By integrating precision etching and electroforming technologies, combined with surface chemical modification and photolithography techniques, high-functional structures featuring electrical insulation, high thermal conductivity, low deformation, high mechanical strength, and excellent corrosion resistance are fabricated on mold and device surfaces. This technology has been applied to surface treatments of vacuum equipment used in semiconductor and optoelectronic device manufacturing processes, as well as to the fabrication of microfluidic channels and microstructures for microsensors and precision molds.
■ Technology Features
▶ High precision: controlled anodic film thickness; ±1mm thickness tolerance on concave/
convex features to meet UHV requirements.
▶ High uniformity: periodic AAO templates with pore diameters of 25~300 nm, up to A4 size.
▶ Low-carbon, low-energy processes:e.g., in-line non-fluorinated lubricious coatings and pilotscale
manufacturing.
▶ Micro-features: critical dimensions 10~500 μm(e.g., mass production of composite metallic
microtubes/probes, planar probes; microchannels for ultrathin heat pipes/microreactors)
■ Applications
▶ Anodic treatment and precision polishing for semiconductor equipment/components.
▶ Microchannel fabrication for precision heat pipes.
▶ Precision sieves and surface finishing for metallic extensions.
▶ Micrometer-scale probes for semiconductor process inspection.
■ Contact Us
Material and Chemical Research Laboratories
Dept. of Precision Micro-forming and Surface
Materials Finishingn(J400)
Fang-Jui Fong
Tel:03-03-5915298
E-mail:itri950451@itri.org.tw