Build-up Material and SAP Evaluation Platform
Develop various laminated thin films and a lab-scale SAP process to support customers’formulation and feasibility evaluation.
CB Materials Validation Platform–Resins / Substrates / Build-up Materials
Low-Solvent FPC Adhesive Technology
■ Introduction
▶ Flexible circuit board adhesives consume~6,660 tons of MEK annually; most is incinerated after coating, resulting
in low solvent recovery and high environmental impact.
▶ With existing coating/lamination equipment constraints, solvent reduction relies on formulation innovation and
process optimization.
■ Technical Innovation Approach
▶ Develop low-solvent adhesive formulations tailored for flexible printed circuits.
▶ Replace solid plasticizers with liquid plasticizers; apply chemical modification to ensure epoxy-component
compatibility under ultra-low solvent conditions.
▶ Optimize coating and curing parameters to maintain reactivity and suitable rheology during lamination.
■ Field Validation
Co-Packaged Optics PCB Materials
■ Introduction
▶ Dielectric materials offer high manufacturability and flexibility to meet product requirements.
▶ Optical path build-up technology enables easy integration of optical routing into circuit
substrates.
■ Core technology
▶ Dielectric material technology: Low-loss, high-temperature-stability modified PPO
resin with low-CTE formulation, suitable for core boards, PP, and RCC.
▶ Optical path build-up technology: PCB build-up optical routing materials for
optically integrated substrates such as CPO substrates.
■ Demonstration
■ Contact Us
Material and Chemical Research Laboratories
Dept. of Functional Substrate Materials(V400)
Jyh-Long Jeng
Tel:03-5914140
E-mail:A-long@itri.org.tw