Energy-saving Packaging Material Technology
▶ Core-shell catalyst structure designed for storage stability.
▶ Active catalyst selection for low temperature curing or reducing curing time.
Compound Semiconductors: Low-loss Packaging Material Technology High-frequency Modules
■ Technology Overview
Development of a new low-loss resin with low dielectric constant(Dk)and low dielectric dissipation factor(Df), featuring high thermal resistance and suitable for liquid molding compound applications.
■ Key raw materials
▶ New Low-loss Resin
■ Achievements 
▶ Taiwan Patent: 110145160(Under Examination)
▶ US Patent: P54100033US(Pending)
▶ Chinese Patent: P54100033CN (Pending)
Easy-to-Disassemble Resin Technology
■ Features
▶ Novel selective chain-splitting resin materials.
▶ Catalytic low-temperature pyrolysis.
▶ Resin systems have advantages in formulation flowability.
■ Key raw materials
It can replace or partially replace existing resin materials.With its liquid properties, the material offers advantages in stress bonding and formulation flowability.
■ Achievements
▶ Patent: Epoxy Resin Composition and Resin Film.
▶ Taiwan, USA, China.(P5400050, pending)
Large-area Wafer-level Liquid Molding Material Verification Platform
■ Contact Us
Material and Chemical Research Laboratories
Dept. of Encapsulation Materials for Devices(V300)
Chih-Hao Lin
Tel:03-5912956
E-mail:howardlin@itri.org.tw