Polyimide Aerogel and Low Dielectric Substrate
■ Features
▶ Open-cell structured polyimide aerogel film
▶ Large pore size: 0.5~2μm.
▶ Porous film produced by ambient-pressure drying.
▶ Low dielectric constant and low thermal conductivity.
▶ TW patent granted(I887816); US and CN applications under review.
■ Applications
▶ Schematic diagram of a copper-patterned low-dielectric substrate :
■ Core Technology
A large-pore, network-crosslinked structure is fabricated via the sol–gel method, enabling the preparation of polyimide aerogel films through simple ambient-pressure drying.
Polyimide Porous Coating
■ Features
▶ Optimized coating composition enhances compatibility and adhesion.
▶ A simple coating process forms a porous film.
▶ Low dielectric constant and loss.
▶ Suitable for roll-to-roll coating on copper foil.
■ Core Technology
A porous coating is produced by formulating a modified polyimide resin and inducing pore formation through heat baking.
■ Applications
Used for：
▶ High-frequency FPCB.
▶ Connects RF module and baseband chip.
▶ Low dielectric insulating coating.
▶ Automotive radar.
▶ Connected vehicle module.
High Heat Dissipation Insulated Metal Substrate Material
■ Technical characteristics
▶ High insulation,high peel strength.
▶ Can be coated on copper foil or PET, and perform whole roll continuous coating
process
▶ Patent(thermal conductive composition): TW patent granted(I867943) and US & CN applications
under
Die Attach Material
■ Features
▶ Low-temperature curing process(180~200℃ ) In-house synthesized nanosilver particles.
▶ Particle size stacking/blending technology High thermal conductivity combined with
strong adhesion to Ag-plated surfaces.
▶ TW patent granted(I848493); CN applications under review.
■ Technology
■ Application
▶ Electric Vehicle Power Modules.
▶ AI Chips and Modules.
▶ High-Power Components.
▶ Network Communication Equipment.
Thermal Gel(TIM1)
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■ Features |
■ Application |
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▶ Low-temperature 150℃ curing process
▶ Silicone with low Tg, high thermal stability, and good flexibility
▶ Low stress, reducing interfacial crack formation
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▶ AI Server
▶ Power Supply
▶ Advanced Semiconductor Packaging
▶ GPU、HBM
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■ Technology
A New Era of High-Efficiency Non-Fluorinated Immersion Coolants
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■ Features |
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▶ non-fluorinated materials aligned with ecofriendly trends.
▶ Verified through:
● chem stability.
● Vehicle.
● Heat dissipation.
▶ anti-aging and anti-corrosion.
▶ Two types of coolant products.
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Silicone |
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▶ Branched chemical structure.
▶ High FP and stable chemical properties.
● TW patent granted (I843316)
● US & CN applications under
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■ Application |
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▶ Data centers.
▶ energy storage.
▶ EV charging.
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Synthetic ester |
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▶ Low viscosity.
▶ Low acidity.
▶ Stable chemical properties .
● TW,US & CN applications under review.
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Comprehensive Evaluation Solution for Coolants: Lab to On-site
■ Fundamental Property Testing
▶ Coolant measurement platform.
▶ Material compatibility test(single-phase)
▶ Safety evaluation(overheating; Arc)
■ Coolant Stability Evaluation
Adopting accelerated aging methods: Enables more effective monitoring, helping reduce risks and maintenance costs.
■ a-site Testing
▶ Heat exchange analysis Dummy heater required small amount of coolant.
▶ pPUE testing on vehicle Use Intel Open IP 4U immersion system for reliability
evaluation in actual deployment conditions.
■ Contact Us
Material and Chemical Research Laboratories
Dept. of Organic Thermal Management Materials(V200)
Alice Tsao
Tel:03-5917650
E-mail:AliceHYTsao@itri.org.tw