Dry Film Photoresist Verification Platform

■ Technical Innovation Features

  ▶ Integration of liquid photoresist and dry-film process enhances thick-film uniformity and

     resolution.

  ▶ Lithography and electroplating technologies enable heterogeneous bump formation on

     ABF/Cu substrates.

 

■ Core Technical Capabilities

  ▶ Integration capability for thick-film photoresist processes.

  ▶ Establishment of a collaborative lithography and electroplating verification platform.

 

■ Technical Achievements

 

 

 

Semiconductor Photoresist Verification Platform

■ Technical Innovation Features

Establish a semiconductor-grade photoresist process line to assess coating uniformity, adhesion, sensitivity, contrast, and development rate, accelerating localization of the materials supply chain.

 

■ Photoresist Verification Technology

 

 

■ Core Technical Competencies

  ▶ Analysis and evaluation of photoresist sensitivity, contrast, and development rate.

  ▶ Photoresist formulation and process verification technologies enable precise performance

     assessment and process optimization.

 

 

 

■ Contact Us

Material and Chemical Research Laboratories

Dept. of Photosensitive Materials and Applications(V100)

 

Yao-Jheng Huang

Tel:03-5918591

E-mail:YJ-Huang@itri.org.tw