Development of Printing Ink and Key Materials

White UV IJP Legend Ink for Rigid/Flexible PCB
■ Features
UV IJP ink is made with high solid content, high stability white slurry and functional UV resin. The advantages of the ink includes high opacity, hardness and bending resistance, which meet the IPC standard for PCB.
■ Specification
■ Applications
Specification Applications

Binder Jet 3DP Ink
■ Features
The 3DP binder is developed with jet ink with low viscosity, high adhesion strength and high toughness by formulation of water base resin, which can be used for different kinds of polymer powders.

■ Specification ■ Applications
Specification Applications

AI Coloring System
The AI coloring system can increase the manufacturing efficiency and reduce material waste in the process.
■ Benefits
  ● Increase efficiency>50%(5~6hr→1~2hr)
  ● Reduce material waste>25%(320 kg → 240 kg per 10,000 meter)
  ● Save human resource>35%

 
AI Coloring System
 
Aqueous R2R Printing Ink
■ Features
The aqueous R2R print ink is developed for low surface energy substrate with high adhesion and color density.
■ Specification ■ Applications
Specification Applications

Dispersant for High Opacity Aqueous White Slurry
■ Features
Development of dispersant for aqueous white slurry with high stability and high solid content without ball milling.

■ Specification ■ Applications
Specification Applications

Dispersant for High Opacity UV Cured White Slurry
■ Features
Development of Dispersant for IJP UV cured white slurry with high stability and high opacity.

■ Specification ■ Applications
Specification Applications

Aqueous Black Slurry and Paints made from Recycled Toner
■ Features
The aqueous black slurry is developed with over 50wt% recycled toner which meets Global recycled standard(GRS). The black paints made with black slurry reach the requirement of Recycled claim standard(RCS).

■ Specification ■ Applications
Specification Applications

IJP MOD Cu Ink
■ Features
Copper ink developed with metal oxide decomposition(MOD)method has good solubility and stability. MOD Cu ink can reach low resistivity through reduction process by baking.

■ Specification ■ Applications
Specification Applications

 

 
■ Contact Us
Material and Chemical Research Laboratories
Dept. of Digital Printing Materials(R600)
 
Wen-Pin Chuang Tel:03-5732783
Email:tonyboy@itri.org.tw
 
Cha-Wen Chang Tel:03-5732593
Email:ChaWen@itri.org.tw
 
Hsi-Kang Shih Tel:03-5732470
Email:stanley.shih@itri.org.tw