雙粒子束聚焦式離子束顯微切割儀(DB-FIB)

Dual Beam-Focused Ion Beam

一、設備基本資料:

功能簡介:

主要用途為奈米材料之奈米尺度切割、加工、蝕刻、操縱與分析檢測。本儀器設備具備有下列功能:

•定點切割

•選擇性的材料蒸鍍

•強化性蝕刻或選擇性蝕刻

•蝕刻終點偵測

•奈米尺度操控

•奈米尺度之高解析影像觀測

本儀器為工研院奈米中心奈米材料蝕刻、蒸鍍、加工、操控、分析與檢測之儀器。

 

應用領域:

Nano-characterization applications :

•3D reconstruction by sequential sectioning and imaging (Slice and View)

•Phase contrast characterization by ultra-high resolution in-lens backscattered electron imaging

•Grain contrast characterization by secondary ion imaging

•Real-time milling feedback by SPI - simultaneous patterning and imaging

•Bright- and dark-field imaging characterization by 30 kV STEM on FIB-prepared cross sections

•Nano-analysis (chemistry, texture) on FIB-prepared cross-sections

二、設備型錄資料:

廠牌及型號: FEI Nova 200 NanoLab

詳細功能規格:

重要規格: Accelerating Voltage: Electrons: 0.2 to 30 kV、 Ions: Upto 30Kv

Electron Filament: Schottky Field Emitter

SEM Resolution: 3.5nm @ 30kV at high vacuum、3.5nm @30kV in ESEM mode、<15nm @ 3kV in low vacuum mode

Ion Resolution: 7nm @ 30kV @ 1pA

Specimen stage: 5 - axis motorized stage, 50 x 50 mm

System control: Windows 2000? based 32 bit graphical user interface
主要附件:

 

Dectectors:

Electron Imaging

In-lens SE detector

In-lens BSE detector

STEM detector

Ion Imaging

Direct Ion detector

Gas Injectors:

Platinum deposition、Metal Enhanced Etch、Insulator enhanced etch (XeF2)、Selective Carbon Mill

Software:

AutoFIB, AutoTEM, Slice and View, Pro image analysis software

Nano-Manipulator