zGlue fabric reduces size of wearable tech
Silicon interposer technology allows multiple die to be combined onto a single chip. This is different from stack or multi-die chips that use wires to connect to a substrate. Essentially,
2017/08/15 3D IC combines CNT transistors, ReRAMs and sensors
2017/07/29 IHS Markit sees 63% surge in AMOLED panel market t...
2017/06/29 Quantum nanoscope
2017/05/31 Self-powered flexible mic/speaker is 0.1mm thin
Metallization of Polymer Balls and Its Applications
Metallization of Glass Substrate
Development of Green Manufacturing of Polyphenylene Sulfide (PPS) Resins
Green Manufacturing Process and Applications for Polyethersulfone (PES)
The Application of Liquid Crystal Polymer (LCP) Film
OLEDs World Summit
5th International Symposium on Sensor Science
Korea Display Conference 2017
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